Global Active Technologies
Desktop
AOI GVT
760 CE
GVT 760 AOI desktop
Check for :
Parts and polarity
Component presence and position
Solder appearance fillet
Lead defects
Foreign material
Applicable PCB Applicable manufacturing process Post
reflow
PCB thickness +/-3 mm ( for bending)
PCB clear height Up ≤ 30 mm ; down ≤60 mm
Inspection Items Post reflow Component missing,
excessive component, solder ball, solder misalignment, edge-on,
tombstone, mounting side down, wrong polarity, wrong
component, bad component, solder bridging, cold soldering,
solder unavailability, insufficient solder, excessive solder,
component up, IC pin up, IC pin bent
Vision System Image pickup system Color CCD
Illuminating system Four-color LED ring light source
Resolution 15μm
Inspection principle Color calculation, color extraction,
grey-scale calculation, image contrast
Mechanic System X/Y driving system AC servo motor +
precise ball lead-screw
Splint method Bilateral Automated Fixture
Positioning accuracy 8 μm
Moving speed 700 mm/s (Max)
Track adjustment Manual
Software System Operating system Windows XP
Language English ; Chinese optional
Output Substrate ID, substrate names, element name,
name of defects, defect pictures, etc
Optional accessories Offline programming system, SPC
system, Barcode identification system, etc
