Global Active Technologies
Desktop
AOI GVT
760
CE
GVT 760  AOI desktop

Check for :
Parts and polarity
Component presence and position
Solder appearance fillet
Lead defects
Foreign material
Applicable PCB        Applicable manufacturing process        Post
reflow
       PCB thickness        +/-3 mm ( for bending)
       PCB clear height        Up ≤ 30 mm ; down ≤60 mm
Inspection Items        Post reflow         Component missing,
excessive component, solder ball, solder misalignment, edge-on,
tombstone, mounting side down, wrong polarity, wrong
component, bad component, solder bridging, cold soldering,
solder unavailability, insufficient solder, excessive solder,
component up, IC pin up, IC pin bent
Vision System        Image pickup system        Color CCD
       Illuminating system        Four-color LED ring light source
       Resolution        15μm
       Inspection principle        Color calculation, color extraction,
grey-scale calculation, image contrast
Mechanic System        X/Y driving system        AC servo motor +
precise ball lead-screw
       Splint method        Bilateral Automated Fixture
       Positioning accuracy        8 μm
       Moving speed        700 mm/s (Max)
       Track adjustment        Manual
Software System        Operating system        Windows XP
       Language        English ; Chinese optional
       Output        Substrate ID, substrate names, element name,
name of defects, defect pictures, etc
Optional accessories        Offline programming system, SPC
system, Barcode identification system, etc