Global Active Technologies
G500
Manual
Hotair BGA
Rework
Station
Specifications:
PCB dimension: W50×D50~W500×D500mm
PCB thickness: 0.5~4mm
PCB locating way: Outer or Jig
Nozzle heat: 800W
Bottom preheater: far infrared 2800W
Machine dimension: L750×W780×H700mm
Temperature control: K-type thermocouple close cycle controlled
Lower hot-air heater: 800W
Power supply: single-phase, 220V,50/60Hz
Weight: Approx. 55kgs
Features:
●Made of high quality heating material; desoldering and soldering procedures of
BGA are precisely controlled;
●Air flow and temperatures are adjustable in a wide range to produce high
temperature breeze;
●Movable heating head, easy to operate.
●Touch screen interface, PLC control, able to display temperature curves and
detecting curves at the same time.
●Three independent heating areas, temperatures and time can be displayed
digitally on the touch screen;
●8 segments of temperature up (down) and 8 segments constant temperature
control, 50 groups of temperature -
curves are stored;
●The height of bottom heating nozzle is micro-adjustable;
●The whole preheating zone can moved horizontally, so as to be suitable for
more types of BGA and PCB of bigger
size.