Global Active Technologies
Vision BGA
Rework
Station
GV520
Rework
Station
GV520
Specifications
PCB dimension:W20*D20~W400*450
PCB thickness:0.5~4mm
Working table adjustment: ±10mm Forward/backward, ±10mm Left/right
Temperature control: K-type Thermocouple,Close Cycle Controlled
Area heater: Far infrared,2700W
Top heater: Hot Gas,400W
Bottom heater: Hot Gas,800W
PCB locationway: Outer
Power supply: Single-phase 220v,50/60Hz
BGA dimension: 1*1~70*70mm
Min pitch of BGA ball: 0.15mm
Placement precision: 0.01mm
Max BGA weight: 300g
Machine dimension: L700*W650*H800
Weight: Appox 120kgs
Features:
● The movable heating head is easy to operate; hot air head and mounting
head are manually
controlled; PCB sliding rack is micro-adjustable with X and Y axis;
● Color optical system with functions such as spilt vision, zoom-in and micro-
adjust, auto focus
and menu operation, equipped with aberration detection device;
● Embedded industrial computer can analyze the two practically-tested profiles,
and compare
them with the history saved profiles;profile saving no limit for the industrial
computer;
● Color LCD monitor, touch screen interface;
● Three heaters heating independently, both upper and lower heater can
control multi stages
on the profile simultaneously, large bottom IR heating area to heat PCB evenly;
temperature,
time, rate, cooling and alarm events are all displayed on the touch screen;
● Over-heating protection for the hot air heating head; temperature of hot air in
the upper and
infrared at the bottom is program controllable; 6segments of temperature up
(down) and 6 segments constant temperature control, profile saving is unlimited
in the industrial computer; profile analysis can be carried out on the touch
screen; with computer communication function
as computers, with communication software attached; with temperature
measurement function;
● The supports for the BGA soldering supporting frame are micro-adjustable to
restrain local sinkage in the soldering area;
● Built-in vacuum pump;60 rotating in φ angle mounting nozzle is micro-
adjustable.
● Large IR pre-heating from the bottom, made of imported high quality heater,
will heat the PCB
evenly to avoid deformation and keep solder effect; heating board is
independently controlled;
● Equipped with different hot air nozzles, easy to replace and able to locate in
any angle.
PCB dimension:W20*D20~W400*450
PCB thickness:0.5~4mm
Working table adjustment: ±10mm Forward/backward, ±10mm Left/right
Temperature control: K-type Thermocouple,Close Cycle Controlled
Area heater: Far infrared,2700W
Top heater: Hot Gas,400W
Bottom heater: Hot Gas,800W
PCB locationway: Outer
Power supply: Single-phase 220v,50/60Hz
BGA dimension: 1*1~70*70mm
Min pitch of BGA ball: 0.15mm
Placement precision: 0.01mm
Max BGA weight: 300g
Machine dimension: L700*W650*H800
Weight: Appox 120kgs
Features:
● The movable heating head is easy to operate; hot air head and mounting
head are manually
controlled; PCB sliding rack is micro-adjustable with X and Y axis;
● Color optical system with functions such as spilt vision, zoom-in and micro-
adjust, auto focus
and menu operation, equipped with aberration detection device;
● Embedded industrial computer can analyze the two practically-tested profiles,
and compare
them with the history saved profiles;profile saving no limit for the industrial
computer;
● Color LCD monitor, touch screen interface;
● Three heaters heating independently, both upper and lower heater can
control multi stages
on the profile simultaneously, large bottom IR heating area to heat PCB evenly;
temperature,
time, rate, cooling and alarm events are all displayed on the touch screen;
● Over-heating protection for the hot air heating head; temperature of hot air in
the upper and
infrared at the bottom is program controllable; 6segments of temperature up
(down) and 6 segments constant temperature control, profile saving is unlimited
in the industrial computer; profile analysis can be carried out on the touch
screen; with computer communication function
as computers, with communication software attached; with temperature
measurement function;
● The supports for the BGA soldering supporting frame are micro-adjustable to
restrain local sinkage in the soldering area;
● Built-in vacuum pump;60 rotating in φ angle mounting nozzle is micro-
adjustable.
● Large IR pre-heating from the bottom, made of imported high quality heater,
will heat the PCB
evenly to avoid deformation and keep solder effect; heating board is
independently controlled;
● Equipped with different hot air nozzles, easy to replace and able to locate in
any angle.
